JPH0476495B2 - - Google Patents

Info

Publication number
JPH0476495B2
JPH0476495B2 JP61096068A JP9606886A JPH0476495B2 JP H0476495 B2 JPH0476495 B2 JP H0476495B2 JP 61096068 A JP61096068 A JP 61096068A JP 9606886 A JP9606886 A JP 9606886A JP H0476495 B2 JPH0476495 B2 JP H0476495B2
Authority
JP
Japan
Prior art keywords
stage
substrate
conductive gas
pressure
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61096068A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62252943A (ja
Inventor
Moritaka Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9606886A priority Critical patent/JPS62252943A/ja
Publication of JPS62252943A publication Critical patent/JPS62252943A/ja
Publication of JPH0476495B2 publication Critical patent/JPH0476495B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP9606886A 1986-04-25 1986-04-25 高周波プラズマエツチング装置 Granted JPS62252943A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9606886A JPS62252943A (ja) 1986-04-25 1986-04-25 高周波プラズマエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9606886A JPS62252943A (ja) 1986-04-25 1986-04-25 高周波プラズマエツチング装置

Publications (2)

Publication Number Publication Date
JPS62252943A JPS62252943A (ja) 1987-11-04
JPH0476495B2 true JPH0476495B2 (en]) 1992-12-03

Family

ID=14155100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9606886A Granted JPS62252943A (ja) 1986-04-25 1986-04-25 高周波プラズマエツチング装置

Country Status (1)

Country Link
JP (1) JPS62252943A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646627B2 (ja) * 1986-10-20 1994-06-15 東京エレクトロン株式会社 処理装置
JPH0730468B2 (ja) * 1988-06-09 1995-04-05 日電アネルバ株式会社 ドライエッチング装置
US5248370A (en) * 1989-05-08 1993-09-28 Applied Materials, Inc. Apparatus for heating and cooling semiconductor wafers in semiconductor wafer processing equipment
JP2009191960A (ja) * 2008-02-14 2009-08-27 Osaka Prefecture Univ ヘリウムガス用パイプライン
JP6490754B2 (ja) * 2017-07-12 2019-03-27 Ｓｐｐテクノロジーズ株式会社 プラズマ処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56131930A (en) * 1980-03-19 1981-10-15 Hitachi Ltd Controlling device of wafer temperature
US4457359A (en) * 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
JPH0693446B2 (ja) * 1983-11-09 1994-11-16 株式会社日立製作所 処理装置

Also Published As

Publication number Publication date
JPS62252943A (ja) 1987-11-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term